High gloss PC-GN-3410R-Panlite enhanced PC Japanese Emperor

Description :

　　Panlite® sold by Yingxin Engineering Plastic Raw Materials Co., Ltd. in China; It is a thermoplastic resin with a high polymer molecular structure, which can be processed by injection molding, extrusion molding, blow molding and other molding methods.

　　It is sometimes difficult to distinguish whether the bubbles or vacuum bubbles present inside transparent PC products. It is generally believed that if a bubble point is found at the moment of mold opening and there is no significant change in volume after storage for a period of time, it is a bubble caused by gas interference; If it appears and becomes larger during the demolding cooling process, it belongs to a vacuum bubble.

　　The formation of vacuum bubbles is due to insufficient material or low pressure during mold filling. Under the rapid cooling effect of the mold, the surface of the molten material in contact with the mold wall first solidifies, and then the molten material in the central part cools and shrinks, resulting in a reduction in volume and the formation of a hollow or bubble point.

　　The solution is:

　　High injection pressure, time, and material quantity

　　Adjust material temperature: When the vacuum bubble is far away from the gate position, increase the material temperature to make the molten material flow smoothly, and the pressure can be transmitted to the part far away from the gate

　　When the vacuum bubble is placed near the gate, it can lower the material temperature and reduce shrinkage

　　Appropriately increase the mold temperature, especially the local mold temperature at the location where vacuum bubbles are formed

　　Place the sprue in the thick walled area of the product to improve the flow conditions of the nozzle, runner, and sprue, as well as the exhaust condition of the mold

　　Shorten the cooling time of the product in the mold, and if necessary, slowly cool the product by immersing it in hot water

　　Products formed with sprues can be molded at slow and low temperatures to solve the problem of vacuum bubbles. When there are vacuum bubbles on the runner, the runner size can be increased

　　In addition, it was found during the production process that the PC product quickly developed bubbles in the thick walled area after demolding, which was caused by insufficient cooling leading to the expansion of gas inside the PC.

　　Generally, measures such as extending the cooling time, enhancing the cooling effect, increasing the holding pressure and time, and delaying PC decomposition can be taken to solve the problem

　　(Kind reminder: Due to the constantly changing plastic market, the raw material prices on the page may differ from the actual prices, for reference only. Please understand! The price is subject to the actual quotation market on the day. Please feel free to inquire by phone

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