Polymer surface plasma activation roughening material surface properties Guangdong vacuum plasma equipment manufacturer
Category:
Environmental Protection/Cleaning and cleaning equipment/Cleaning machine
Model:
CRF-VPO-4L-S
Brand:
CRF/Chengfeng Intelligent Manufacturing
model:
CRF-VPO-4L-S
mode of movement:
wheeled
Processing & Customization:
yes
Drive Type:
power supply
purpose:
Product surface plasma cleaning treatment to enhance material surface adhesion
weight:
eighty
Place of Origin:
Shenzhen, Guangdong
manufacturer:
Shenzhen Chengfeng Intelligent Manufacturing Co., Ltd
Retail Price
158,800.00USD
重量
kg
- Product Description
-
model CRF-VPO-4L-S
mode of movement wheeled
Processing & Customization yes
Drive Type power supply
purpose Product surface plasma cleaning treatment to enhance material surface adhesion
weight eighty
Place of Origin Shenzhen, Guangdong
manufacturer Shenzhen Chengfeng Intelligent Manufacturing Co., Ltd
Description :
Shenzhen Chengfeng Intelligent Manufacturing Co., Ltd. is an enterprise dedicated to providing plasma equipment and process solutions, using plasma surface treatment technology to solve product surface treatment problems for customers.
A small vacuum plasma cleaning machine with customizable processing space to enhance processing capacity. It adopts a PLC+touch screen control system to effectively control equipment operation;
We can customize the device cavity capacity and number of layers according to customer requirements to meet their needs;
Low maintenance and repair costs, facilitating customer cost control; High precision, fast response, good handling and compatibility, complete functions and technical support.
Chengfeng Zhizao vacuum plasma cleaning machine equipment is suitable for the printed circuit board industry, semiconductor IC field, silicone, plastic, polymer field, automotive electronics industry, aviation industry, etc. Printed circuit board industry: high-frequency board surface activation, multi-layer board surface cleaning and de drilling, soft board and soft hard bonding board surface cleaning and de drilling, activation before soft board reinforcement. Semiconductor IC field: COB, COG, COF, ACF processes, used for cleaning before wire bonding and soldering; Plasma surface roughening, etching, and activation of silicone, plastics, and polymers in the field of silicone, plastics, and polymers.
A vacuum plasma cleaning machine uses plasma formed by gas ionization to perform surface treatment on product workpieces, whether for cleaning or surface activation. In order to achieve better treatment results, different processing gases need to be selected for different products. Common processing gases for plasma cleaning machines include oxygen (O2), argon (Ar), nitrogen (N2), compressed air (CDA), carbon dioxide (CO2), hydrogen (H2), carbon tetrafluoride (CF4), etc.
AfterSalesService :
Key words:- Plasma equipment manufacturer
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